 | | | Philips Assembleon MC-8 | |
MC-8: NEW!
Even more flexibility for your most demanding applications
Based on the MG-8R, the MC-8 incorporates a significant improvement package, bringing you improved reliability and enhanced maintainability. Flexibility and ease of use is lifted to a new level with the new intelligent electrical feeder, accompanied by default installed tape cutters, which allows the system to pack up to 119 feeders.
The MC-8 delivers high-end performance with chips, ICs and odd-form components. Not only does it offer placement rates up to 8.9k components per hour with a placement accuracy of 30 micron for ICs and QFPs, but it also handles an extremely wide component range. Precision force control allows optimal handling of press-fit through-hole connectors with insertion forces up to 30 N.
The MC-8 is equipped with 3 fully independent servo-controlled Flying Nozzle Change (FNC) heads, each carrying up to 6 nozzles. It delivers high-end performance with chips, ICs and odd form components. Not only does it offer placement rates up to 8.9k components per hour with a placement accuracy of 30 micron for ICs and QFPs, but it also handles an extremely wide component range as tall as 25.5 mm. Precision force control allows optimal handling of press-fit through-hole connectors with forces up to 30N.
By holding up to 119 feeding positions, the MC-8 offers the ultimate in changeover flexibility.
Main benefits
The standard MC-8 comes with many software and hardware features that improve product quality, increase production efficiency and reduce maintenance, including:
· Intelligent electrical feeders
· Z-Servo controlled placement heads for accurate stress-free component mounting
· Automatic board width and thickness adjustment for fast changeover
· Automatic nozzle cleaning station
· Automatic temperature feedback compensates for temperature variations
· Fiducial recovery function that eliminates the need to remove and clean the PCB
· Feeder indicators that simplify setup and reduce feeder setup
· Double board support system that decreases board transfer time
· Force control
· Tape cutting
|
Specifications |
|
Maximum output per hour |
8.9k |
|
|
|
IPC 9850 output per hour |
7.9k |
|
|
|
Placement accuracy at 3 sigma |
50 micron for chips, 30 micron for QFPs |
|
|
|
Component range |
0.4 x 0.2 mm (01005) to 100x45 mm or 55x55 mm |
|
|
|
Maximum component height |
25.5 mm |
|
|
|
Programmable placement force |
10 to 30 N |
|
|
|
Maximum board size (L x W) |
510 x 460 mm (20x18") |
|
|
|
Minimum board size (L x W) |
50 x 50 mm (2x2") |
|
|
|
Board thickness |
0.4 to 3 mm |
|
|
|
Automatic tool bit exchange |
nozzles and/or grippers |
|
|
|
Tape feeding positions (8 mm) |
119 |
|
|
|
Feeder options |
tape, stick, tray, other |
|
|
|
Footprint (L x W) incl. front side feeder trolleys |
1655 x 1562 mm |
|
| | 
 "Philips Assembleon MC-8")
