 | | | Philips Assembleon MG-1R | |
Thanks to a high precision single placement beam that carries eight independent Z-servo controlled heads, the MG-1R provides a perfect balance between chip and IC shooting. It is available in two versions: one with a Flying Nozzle Change (FNC) head for when many nozzle changes are needed and high output is important, the other with a Super Fine (SF) head for use with a wider component range including QFPs, connectors and tall components.
With placement rates up to 24k components per hour, the MG-1R is fast. Placement accuracy is 30 microns for ICs. It handles a wide range of components from 01005 to large connectors (45 x 100 mm), fine-pitch and components up to 15 mm tall. The MG-1R holds up to 96 tape feeders, including stick and bulk parts.
Main benefits
The standard comes with software and hardware features to improve product quality, increase production efficiency and reduces maintenance, including:
- Z-Servo controlled placement heads for accurate stress-free component mounting.
- Automatic board width and thickness adjustment for fast changeover.
- Automatic nozzle cleaning station.
- Automatic temperature feedback to compensate for temperature variations.
- Fiducial recovery function that eliminates the need to remove and clean the PCB.
- Feeder indicators that facilitate easy setup and reduce feeder setup.
- Double board support system for reducing board transfer time.
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 "Philips Assembleon MG-1R")
