Full Convection Reflow Oven

Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards.

Hot air full convection reflow oven

Soldering of complex SMD boards and new package technologies requires a well-controlled soldering process. The RO400FC uses full convection only to heat PCBs homogeniously. The convection technology uses vertical laminar flow, which offers an efficient heat transfer with the lowest delta T values. This technology makes the RO400FC suitable for lead free solders as well.
Zone temperatures – three preheat and one peak – are fully programmable, as is the closed-loop-controlled conveyor speed. Zone temperatures are measured within the airflow at the board height to guarantee highly reproducible soldering conditions.
The universal mesh belt or the precise chain conveyor transports single or double-sided boards up to 400 mm (15.7“) width.

Full convection heating for even temperature distribution

For solder pastes with or without lead
High air volume for low thermal stress
Efficient heat transfer
Mesh belt or chain conveyor
Closed loop controlled conveyor drive system
Integrated microprocessor control with LCD
Built-in overheat security switches

The RO400FC is equipped with 5 special oven steel hot air convection modules (four top / one bottom within the reflow zone). Each module contains a high volume blower and unique airflow construction for ideal heat transfer.

The integrated microprocessor control with LCD display provides an easy-to-use operator interface and storage capacity of up to 28 profiles. The memory provides program proposals and enough space for own profiles.

With RO-CONTROL new soldering tasks can be simulated and it offers unlimited storage space for programs. Measured temperature profiles can be superimposed graphically.