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| | | Pyramax 75 A Reflow oven:
A - Air version.
Maximum temperature rating (all zones): 350°C
Nominal operating temperature: 80-350°C
Number of controlled heated zones: 6 Top
3 Bottom
Oven atmosphere: Air
Working dimensions:
Conveyor belt 457 mm[more...] | |
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| | | Pyramax 100 A or N Reflow oven:
A - Air version.
N - Nitrogen version.
A. General Specifications
Maximum temperature rating (all zones): 350°C
Nominal operating temperature: 80-350°C
Number of controlled heated zones: 8 Top
8 Bottom
Oven atmosphere: Air or Air/N2
Working dimensions:
Conveyor belt 457 mm.[more...] | |
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| | | Pyramax 125 A or N Reflow oven:
A - Air version.
N - Nitrogen version.
General Specifications
Maximum temperature rating (all zones): 350°C
Nominal operating temperature: 80-350°C
Number of controlled heated zones: 10 Top
10 Bottom
Oven atmosphere: Air or Air/N2
Working dimensions:
Conveyor belt 457 mm
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| | | Pyramax 150 A or N Reflow oven:
A - Air version.
N - Nitrogen version.
General Specifications
Maximum temperature rating (all zones): 350°C
Nominal operating temperature: 80-350°C
Number of controlled heated zones: 10 Top
10 Bottom
Oven atmosphere: Air or Air/N2 .
Working dimensions:
Conveyor belt 457 mm.
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| | | Batch Reflow Oven
Prototyping oven with motorized drawer for automatic processing. Combi-heater system convection/infrared ensures homogenous temperature distribution and enables steep ramps. Integrated microprocessor for profile control and storage.
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| | | Full Convection 4 zone Reflow Oven,
Small but powerful reflow oven. 300 mm process width. Convection Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m.
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| | | Full Convection 5 zone Reflow Oven
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards.[more...] | |
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| | | | The RO-VARIO exclusively heats with hot air convection and can be used for the different tasks in SMT assembly, especially for the reflow soldering of lead free solder pastes or the curing of adhesives. The number and type of heating zones as well as the type of transport system is freely selectable.[more...] | |
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 "Hide Away Center board support")
 "Typical Lead Free Profile")
 "Typical System Layout")
)
 "Unique airflow construction for ideal heat transfer")
 "Control software")
 "On line Temperature profile")
