DKR - Electronic Agencies Ltd. - SPI -3D Solder Paste Inspection & 3D AOI

Koh-Young 3D SPI (Solder Paste Inspection) Models

Shadow Free Thechnology

True Yield Improvement

Extract & Measure solder paste Technique

Bench Top Model 3020T

KY-3020T system is a semi-automatic table top
version of a 3D SPI system based on Koh Young’s
leading-edge technology Delivering the same
measurement performance as Koh Young’s
in-line SPI systems, the KY-3020T system is capable
of 100% 3D inspection of all pads and is best suitable for

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In-Line Model 3030VA/VAL

All kinds of defects from screen printing process
can be detected through
3D inspection, which include not only insufficient
paste, excessive paste,
shape deformity based on 3D volume and shape measurements, but also
cases of no paste, bridging and placement errors
with 2D characteristics.

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In-Line Model 8030

Superb Performance and Value in Automated 3D SPI. Based on High-Performance System, KY-3030 Series
Small Footprint for Efficient Line Integration
Lowest Cost of Ownership.
• True patented 3D volume measurement
• No false calls – no escapes –
no shadow problems
• Highest accuracy and repeatability
• No color sensitivity.

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In-Line Model aSPIre

Koh Young Technology’s new product aSPIre 3D In-line Solder Paste Inspection System adds more value to your production. Keeping with high speed SMT lines, aSPIre system helps maximizing productivity and ensures no compromise is made between speed and accurate 100% 3D measurement capability as well as unrivalled measurement.

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Koh Young 3D AOI (Automatic Optical Inspection) Models

EasyUse Operator interface

Koh Young patented 8-way projection

3D Inspection with Z-measurement

Zenith 3D AOI

A new family of Automated Optical Inspection (AOI) systems, is incorporating a revolutionary new 3D approach. The new Zenith system is based on technology which ‘breaks the 2D’ AOI inspection barrier by incorporating the ability to, in addition to full conventional 2D capability, sense and measure Z-axis of whole assembled PCB.

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