SPI - 3D Solder Paste - Portable Solutions

offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for custom

combines laser measurement accuracy with real-time onboard SPC charting and custom data reports providing the most comprehensive control of the SMT st

system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS and packaged in a rugged, bench-top platform designe

system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS. Packaged in a rugged, bench top platform designe

is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system de

is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-to

incorporates the sophisticated 3D measurement technology found in ASC International's VisionPro M150 and AP212 systems in a production-ready position.

he most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an in

is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads,