FLIP CHIP BONDER

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
FLIP CHIP BONDER
 
 
 
 
FLIP CHIP BONDER: YSH20
 
 
 
 
 
 

High-speed, high-precision flip chip hybrid placer for semiconductor back-end industry. YSH20 is a hybrid surface mounter, specially designed to mount printed circuit boards with flip chips that are used in increasing numbers today in IT communications devices and electric home appliances. Yamahas YSH20 features a high-rigidity frame and dual mount heads and is fitted with a chip recognition system employing a camera with high resolution performance. In addition to providing high levels of mounting accuracy and highest speed.

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
FLIP CHIP BONDER: YSB55w
 
 
 
 
 
 

The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new era in semiconductor packaging for the expanding flip chip market.

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
For any inquiry, please contact us