ECD MEGA M.O.L.E
 
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ECD MEGA M.O.L.E

 

The MEGAM.O.L.E.® 20 Profiler offers a full 20 channels, the most of any traveling profiler in the Thermal Process industry. At only 7.2 mm thick, MEGAM.O.L.E.® 20 provides a thinner and more advanced configuration than previously available, and has the capacity for over 25 separate runs before downloading data.

The MEGAM.O.L.E.® 20 Profiler offers a full 20 channels, the most of any traveling profiler in the Thermal Process industry. At only 7.2 mm thick, MEGAM.O.L.E.® 20 provides a thinner and more advanced configuration than previously available, and has the capacity for over 25 separate runs before downloading data. Thin and narrow shape is especially beneficial when faced with significant physical constraints of nitrogen curtains, and smaller boards.


FEATURES

  • 20 Channels handle large complex boards and enables more detailed information on each assembly
  • 25+ Runs between downloads, eliminating lost data trips to PC. Profile all day, download to your computer at night.
  • M.O.L.E. Readiness Indicators. No wasted runs for a profiler that is not ready.
  • Instant Profile validation with the “OK” Test Button simplifies the evaluation process to a Go/No-Go answer.
  • Thinnest Profiler ever at 7.2 mm. Permits greater insulation for higher/longer thermal excursions
  • Quick connect 5T/C each Nano-Connectors.

BENEFITS

  • MEGAM.O.L.E.® 20 stores multiple data runs (25+), eliminating lost data, and the need to download after every profile.
  • The M.O.L.E.® Readiness indicators: These warn on the internal temperature, battery status, and RF link to ensure a the profiler is ready to run.
  • Quick-Connect “Nano” Thermocouples (TCs) are a real time/space-saver. 20 TCs in such a small package are incredible, but imagine the mess of twisted wire of 20 old-school “mini” connectors.
  • Thinnest Profiler Ever at 7.2 mm- {7” x 2.5” x .28” (7.2mm)}. Some need thin to clear an oven constraint when using Nitrogen back-fill for oxidation reduction. Some need thin to permit greater insulation for higher/longer thermal excursions.