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FLIP CHIP BONDER: YSB55w
The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new era in semiconductor packaging for the expanding flip chip market.
Features of YSB55w
- High bonding accuracy and x3 productivity of conventional machines!
This brings a new era in semiconductor manufacturing packaging for the expanding flip chip market. - High-speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
- High-accuracy: ±5μm (3σ)
- High-quality & flexibility
Specifications
| Model | YSB55w |
| L 240 x W 200 to L 50 x W 50 mm |
| 0.2 to 3.0 mm |
| Left to Right (option : Right to Left) |
| ±5 µm (3σ) (When using Yamaha’s standard components) |
| 13,000 UPH (Including processing time) |
| 12 inch wafer |
| □2 to 30 mm |
| 3-Phase AC 200/208/220/240/380/400/416 V ± 10 % 50/60 Hz |
| 0.45 MPa or more |
| L 2,090 x D 1,866 x H 1,550 mm (YSB55w main unit & wafer feed unit) |
| Approx. 3,600 kg (YSB55w main unit & wafer feed unit) |
Specifications and appearance are subject to change without prior notice.