SMT Assembly Systems YSM Series
Yamaha Motor Co., Ltd. released its new high-efficiency modular surface mounter, the Z:LEX YSM20. This new surface mounter achieving the world's faster
High-Speed High-Precision Universal High-End Printer
11sec/PCB (including Transfer time)
Printing Accuracy3σ：±0.025mmPositioning repeatability3σ：±0.005mm
※Possible to be customized for L610mmBoard
3S Squeegee（Swing Single Squeegee
0402 mm（01005 inch） chip-0.3mm lead-pitch QFP
PSC (Print Stability)
11 sec/cycle* Line-tact High-speed printing capability
*L180 x W130mm PCB/ Squeegee speed 100mm/sec
Repeatability of positioning.
Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing
Yamaha Motor Releases New High-Performance Compact Printer - YCP10.
Printing quality similar to flagship models, compatible with large circuit boards
Introducing the new YSD dispensing system
Building on the success of its total line solutions based on YS-series mounters, the YSP printer and inspection systems, Yamaha will introduce the next level of integration with its new YSD high-speed dispenser.
The Yamaha dispensing systems, already Japans No. 1 dispensing solution,
3D X-ray solder test inspection.
Laminography Technology. Ｃ.L.=Laminography
Reproduce only inspection target
using X-ray shots less than 10.
The new YSi-V model has been developed as a high-end model of the high-speed, high-precision, in-line type "YSi-12" AOI system equipped with optical, infrared and laser inspection functions and the same highly rigid frame as Yamaha surface mounters.
Intelligent SMD storage system SMT Innovation
Achieved automation of storage and refill management for surface mounter components can now monitor a max. of 1,500 reels and load and unload a max. of 33 reels in one batch.
Vastly boosts efficiency by cutting down on the time and trouble for components supply
High-speed, high-precision flip chip hybrid placer for semiconductor back-end industry. YSH20 is a hybrid surface mounter, specially designed to mount printed circuit boards with flip chips that are used in increasing numbers today in IT communications devices and electric home appliances. Yamahas YSH20 features a high-rigidity frame and dual mount heads and is fitted with a chip recognition system employing a camera with high resolution performance. In addition to providing high levels of mounting accuracy and highest speed.
The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new era in semiconductor packaging for the expanding flip chip market.