Yamaha

SMT Assembly Systems YSM Series

• Achieves revolutionary productivity of 200,000 CPH* giving it the world’s fastest speed on a compact platform
• Highest productivity in the world!
• Flexible response for different production configurations!
• High tech to support high mounting quality & a high machine operating rate

Yamaha Motor Co., Ltd. released its new high-efficiency modular surface mounter, the Z:LEX YSM20. This new surface mounter achieving the world's faster

• World’s fastest mounting speed in its class; 5% faster than the YSM20.
  Featuring a new wide-scan camera with improved component adaptability.
• Optional features improving line operating rate without stopping the machine

• Newly-developed Auto Loading Feeder (ALF) that revolutionizes feeding tape components by eliminating reliance on user skill
• sATS30NS Auto Tray Sequencer (ATS) for nonstop tray replacement
• Nonstop feeder carriage exchange system

• 46,000CPH World Leading*1-Beam/1-Head Class, Entry Model Surface Mounter
• Speed increases of 25% or more on conventional models and achieving the world's fastest* mounting capacity
  HM head adopted with new scan camera for broader range of component size compatibility
• Scalability for flexibly adjust to production site requirements
• Enhanced functionality to provide for table production

World’s fastest surface mounter in the 1-Beam, 1-Head Class in comparison of mounting capacity (CPH) under optimal conditions. January 10, 2017, Yamaha Motor data.

• Fusion with Σ technology achieves overwhelming productivity
• Broad-ranging production capacity thanks to the 1-head solution
• Standard features that maintain component mounting quality at a peak level!
• Ensures high-efficiency production with a full range of functions!

High-Speed High-Precision Universal High-End Printer

11sec/PCB (including Transfer time)
Printing Accuracy3σ：±0.025mmPositioning repeatability3σ：±0.005mm
Std.spec：50×50-L510×W460mm
※Possible to be customized for L610mmBoard
3S Squeegee（Swing Single Squeegee
0402 mm（01005 inch） chip-0.3mm lead-pitch QFP
PSC (Print Stability)

11 sec/cycle* Line-tact High-speed printing capability

*L180 x W130mm PCB/ Squeegee speed 100mm/sec
3σ:+/-0.005mm
Repeatability of positioning.

• Cycle time on the world’s fastest level!
• Supports fully-automatic stencil replacement
• Delivers both high quality & super-accurate printing!
• Supports extra-large boards & large-size stencils

Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing

Yamaha Motor Releases New High-Performance Compact Printer - YCP10.

Printing quality similar to flagship models, compatible with large circuit boards

Introducing the new YSD dispensing system

Building on the success of its total line solutions based on YS-series mounters, the YSP printer and inspection systems, Yamaha will introduce the next level of integration with its new YSD high-speed dispenser.
The Yamaha dispensing systems, already Japans No. 1 dispensing solution,

3D X-ray solder test inspection.

Laminography Technology. Ｃ.L.=Laminography
Reproduce only inspection target
using X-ray shots less than 10.

The new YSi-V model has been developed as a high-end model of the high-speed, high-precision, in-line type "YSi-12" AOI system equipped with optical, infrared and laser inspection functions and the same highly rigid frame as Yamaha surface mounters.

Intelligent SMD storage system SMT Innovation

Achieved automation of storage and refill management for surface mounter components can now monitor a max. of 1,500 reels and load and unload a max. of 33 reels in one batch.

Vastly boosts efficiency by cutting down on the time and trouble for components supply

High-speed, high-precision flip chip hybrid placer for semiconductor back-end industry. YSH20 is a hybrid surface mounter, specially designed to mount printed circuit boards with flip chips that are used in increasing numbers today in IT communications devices and electric home appliances. Yamahas YSH20 features a high-rigidity frame and dual mount heads and is fitted with a chip recognition system employing a camera with high resolution performance. In addition to providing high levels of mounting accuracy and highest speed.

The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new era in semiconductor packaging for the expanding flip chip market.

• “1-head solution” to perform various inspections with a single head
• Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
• A thorough and extensive machine-to-machine (M2M) solution
• Statistical Process Control (SPC) for diverse statistical processing
• Optional features to enable handling various products