3D X-ray solder test inspection.
Laminography Technology. Ｃ.L.=Laminography
Reproduce only inspection target
using X-ray shots less than 10.
PCB supply in line conveyor.
Max. board L600 ×W460mm /inline
Max. height Up40mm/Bottom40mm /inline
Target component BGA/CSP, Insertion, SOP/QFP, transistors, R/C Chip, bottom terminal components, QFN, LGA, etc.
Inspention items Missing, Misalignment, Tomb stone, Polarity, Bridge, Foreign material, Absence of solder, Insufficient solder, Lifted lead, Lifted chip, Filet, Each defect name. definition free.
X-ray inspection Imaging method
3D slice imaging using laminography
Resolution Field of View 54um, 28.05×25.33mm 27um, 14.03×12.67mm
19um, 9.35× 8.44mm ,12um, 6.27× 5.63mm
Switch for each inspection target X-ray source
Micro focus closed tube 125KV/100uA
X-ray detector Direct panel X-ray detector
3D available area 4.0sec/view, L510×W360mm
2D available area 1.0sec/view, L600×W460mm
Optical inspection Imaging method R/G/B/IR of 10 image
Illumination Dome shaped 4 illumination
Available area 0.5sec/View, L600×W460
Camera/Lens 5M pixel color camera / telecentric lens Resolution, View
Laser inspection Measuring method Triangular surverying using laser beam